# ESD PEEK CNT; conductive PEEK; antistatic PEEK; PEEK CMP retaining ring; wafer carrier material; photomask pod; wafer clamp; semiconductor test socket; semiconductor plastic materials | RenJie Plastics

> Source: https://www.rjplastics.com/en/article/esd-peek-cnt-semiconductor-manufacturing

## Knowledge of Conductive Plastics

[Home](/en/)›[Support](/en/support/thermally-knowledge)›[Knowledge of Conductive Plastics](/en/support/conductive-knowledge)›**ESD PEEK CNT in Semiconductor Manufacturing**

      Support

      - Knowledge of Thermally Conductive Plastics
- Knowledge of Conductive Plastics
- Knowledge of Modified Plastics

      Need help choosing?

        [Get a quote](/en/contact)

## ESD PEEK CNT in Semiconductor Manufacturing

    **

    ESD PEEK CNT in Semiconductor Manufacturing: Why It Stands Out

As the demand for chips continues to increase in fields such as communication equipment, consumer electronics and automobiles, the global chip shortage is intensifying. The chip manufacturing process is very complex. In terms of semiconductor manufacturing, silicon wafers, electronic specialty gases, masks, photoresists, targets, chemicals and other materials, together with the related equipment, tend to receive more attention. Few people introduce the plastic materials that go throughout the entire semiconductor manufacturing process. This article covers the plastic materials used in semiconductor manufacturing, why ESD PEEK stands out, and the application cases of RenJie® ESD PEEK CNT.

1. Plastic Materials Used Throughout Semiconductor Manufacturing

The biggest challenge facing semiconductor manufacturing is the control of pollution. Especially with the development of semiconductor technology, electronic components are getting smaller and more complex, the tolerance for impurities is getting lower and lower, and the production conditions are becoming more and more demanding — dust removal, high temperature, highly corrosive chemicals and so on. In the entire semiconductor manufacturing process, the main role of plastic is packaging and transmission: connecting the various processing processes, preventing contamination and damage, optimising pollution control and improving the yield of key semiconductor manufacturing processes.

The plastic materials used include PEEK, PPS, PP, ABS, PVC, PBT, PC, fluoroplastics, PAI, COP and others. With the continuous development of semiconductor technology, the performance requirements for materials are getting higher and higher.

| Material class | Examples | Typical role in semiconductor manufacturing |
| --- | --- | --- |
| High-performance engineering plastics | PEEK, PPS, PAI, PEI | CMP retaining rings, wafer carriers, tools, test sockets |
| Commodity and general engineering plastics | PP, ABS, PVC, PBT, PC | Packaging, trays, transfer parts, structural components |
| Fluoroplastics | PFA, PTFE and related grades | High-purity and chemical-resistant parts |
| Optical and low-outgassing plastics | COP | Containers and carriers with strict cleanliness requirements |

Note: the table groups the material families mentioned in the source article by their general role. Specific grade selection always depends on the process step, the cleanliness class and the chemicals involved.

2. Why Does ESD PEEK Stand Out?

In semiconductor manufacturing, more and more people choose ESD PEEK, mainly because of its comprehensive performance, which meets stringent production needs.

2.1 High-Efficiency Antistatic Performance

By adding conductive materials, static electricity can be quickly dissipated, preventing static electricity from damaging the chip and ensuring product yield.

2.2 Stable and Reliable

High temperature resistance allows long-term operation at 260 °C. Chemical corrosion resistance means the material is not affected by the various corrosive reagents involved in the process, making it suitable for a variety of key components.

2.3 Wear-Resistant and Durable

Low friction and high wear resistance reduce the wear of equipment parts, avoid debris contamination and extend the service life of the equipment.

2.4 Convenient Processing

ESD PEEK can be processed into complex shapes through a variety of processes, adapting to the needs of diversified equipment.

2.5 Safety and Compliance

Few impurities and no precipitation of harmful substances — the material meets high standards and helps ensure clean, reliable production.

| Property | ESD PEEK CNT benefit |
| --- | --- |
| Antistatic performance | Conductive materials are added so that static electricity is dissipated quickly and chips are protected |
| Heat resistance | Long-term service at 260 °C |
| Chemical resistance | Unaffected by the corrosive reagents used in semiconductor processes |
| Friction and wear | Low friction, high wear resistance; less part wear and less debris contamination |
| Processability | Can be processed into complex shapes for diversified equipment |
| Cleanliness | Few impurities, no harmful substance precipitation |

3. Application Cases of RenJie® ESD PEEK CNT

This section focuses on the application of RenJie® ESD PEEK CNT in semiconductor manufacturing.

3.1 CMP Retaining Ring

Chemical mechanical polishing (CMP) is a key process technology in wafer production. During the grinding process, a CMP retaining ring is used to fix and secure the silicon wafer. The material selected should have good wear resistance, dimensional stability and chemical corrosion resistance, and should be easy to process, while avoiding scratches and contamination of the wafer surface. The CMP retaining ring is usually made of standard polyphenylene sulfide (PPS).

ESD PEEK CNT has high dimensional stability, good processability, good mechanical properties, good chemical resistance and good wear resistance. Compared with PPS or PEI rings, CMP retaining rings made of PEEK have stronger wear resistance and double the service life, thereby reducing downtime and increasing chip production.

3.2 Wafer Carrier

Wafer carriers, as the name suggests, are used to load wafers, and include wafer carrier boxes, wafer transfer boxes and wafer boats. The time that wafers are stored in shipping boxes accounts for a large portion of the entire production process, and the material, quality and cleanliness of the wafer box itself may have a greater or lesser impact on wafer quality.

Wafer carriers generally use materials that are resistant to high temperatures and have excellent mechanical properties, dimensional stability, durability, antistatic behaviour, low outgassing, low precipitation and recyclability. ESD PEEK CNT can be used to manufacture carriers for general transport processes; antistatic PEEK is generally used. PEEK has many excellent properties — abrasion resistance, chemical resistance, dimensional stability, antistatic properties and low outgassing — which help prevent particle contamination and improve the reliability of chip processing, storage and transfer. Suitable plastics include PEEK, PFA, PP, PES, PC, PEI and COP, generally after antistatic modification.

3.3 Mask Box

A photomask is a pattern master used in the photolithography process in chip manufacturing. It uses quartz glass as a base and is coated with chromium metal to block light. Using the exposure principle, the light source is projected onto the silicon wafer through a photomask to expose and display specific patterns. Any dust or scratches attached to the photomask will degrade the quality of the projected image. Therefore, it is necessary to avoid contamination of the photomask and to prevent particles generated by collision or friction from affecting the cleanliness of the photomask.

To avoid damage to photomasks due to fogging, friction or displacement, photomask pods are generally made of antistatic, low-outgassing and durable materials.

ESD PEEK CNT has the characteristics of high hardness, minimal particle generation, high cleanliness, antistatic performance, chemical resistance, wear resistance, hydrolysis resistance, good dielectric strength and good radiation resistance. During reticle processing, reticles can also be stored in a low-outgassing and low-ionic-contamination environment.

3.4 Wafer Tools

These are tools used to clamp wafers or silicon wafers, such as wafer clamps and vacuum suction pens. When clamping the wafer, the materials used will not scratch the wafer surface and leave no residue, ensuring the cleanliness and integrity of the wafer surface.

ESD PEEK CNT has high temperature resistance, wear resistance, good dimensional stability, a low outgassing rate and low moisture absorption. When PEEK wafer clamps are used to clamp wafers and silicon wafers, there will be no scratches on the wafer surface, and friction does not leave residue on the wafers, thereby improving the surface cleanliness of wafers and silicon wafers.

3.5 Semiconductor Packaging Test Socket

A test socket is a device that electrically connects each semiconductor component's direct circuit to the test instrument. Different test sockets are used to test the various microchips specific to the integrated circuit designer. The materials used for test sockets should meet the requirements of good dimensional stability, high mechanical strength, less particle formation, good durability, a wide temperature range and easy processing.

ESD PEEK CNT meets these requirements: it combines dimensional stability, high mechanical strength, low particle generation, durability, a wide service temperature range and easy processing — which is why it is increasingly selected for semiconductor packaging test sockets.

| Component | Commonly used materials | Where ESD PEEK CNT adds value |
| --- | --- | --- |
| CMP retaining ring | Standard polyphenylene sulfide (PPS); PEI rings also used | Stronger wear resistance and double the service life versus PPS or PEI rings — less downtime |
| Wafer carrier | PEEK, PFA, PP, PES, PC, PEI, COP (generally after antistatic modification) | Used for general transport processes; antistatic PEEK reduces particle contamination |
| Mask box / photomask pod | Antistatic, low-outgassing and durable materials | High hardness, minimal particle generation, high cleanliness, chemical and wear resistance |
| Wafer tools | Wafer clamps, vacuum suction pens | No scratches and no residue on the wafer surface; low outgassing |
| Test socket | Materials with dimensional stability, high strength and wide temperature range | Dimensional stability, high mechanical strength, low particle generation, easy processing |

4. Material Selection at a Glance

Across these applications the same logic applies: the part must not generate particles, must not outgas, must not corrode and must not build up static charge. ESD PEEK CNT is selected when several of these requirements must be met at the same time — in particular high temperature, chemical exposure and wear, where commodity plastics reach their limits.

Note: alternative materials listed above (PPS, PEI, PFA, PP, PES, PC, COP, etc.) remain valid choices for specific process steps. Final selection should be confirmed against the process temperature, the chemicals used and the required cleanliness class.

5. Frequently Asked Questions (FAQ)

What is ESD PEEK CNT?

ESD PEEK CNT is a PEEK-based material with conductive materials added so that static electricity is dissipated quickly. It keeps the heat resistance, chemical resistance and wear resistance of PEEK while providing antistatic performance for semiconductor applications.

Why is ESD PEEK preferred over PPS for CMP retaining rings?

CMP retaining rings are usually made of standard polyphenylene sulfide (PPS). Compared with PPS or PEI rings, CMP retaining rings made of PEEK have stronger wear resistance and double the service life, which reduces downtime and increases chip production.

What temperature can ESD PEEK withstand in semiconductor processes?

ESD PEEK is resistant to high temperature and can work for a long time at 260 °C, which makes it suitable for process steps involving high temperature as well as chemical exposure.

Which plastics are used for wafer carriers?

Suitable plastics include PEEK, PFA, PP, PES, PC, PEI and COP, generally after antistatic modification. ESD PEEK CNT is used for carriers in general transport processes, where low outgassing and antistatic behaviour help prevent particle contamination.

What material requirements apply to photomask boxes?

Photomask pods must be antistatic, low-outgassing and durable, to avoid damage from fogging, friction or displacement. ESD PEEK CNT adds high hardness, minimal particle generation, high cleanliness, chemical and wear resistance, hydrolysis resistance, dielectric strength and radiation resistance.

Can ESD PEEK be processed into complex shapes?

Yes. ESD PEEK can be processed into complex shapes through a variety of processes, which allows it to serve diversified semiconductor equipment components such as retaining rings, carriers, clamps, pods and test sockets.

6. Get RenJie® ESD PEEK CNT

RenJie® supplies ESD PEEK CNT for semiconductor manufacturing, including CMP retaining rings, wafer carriers, photomask pods, wafer tools and packaging test sockets. Tell us the process step, the chemicals involved, the operating temperature and the cleanliness requirement, and our technical team will recommend the right grade.

ESD PEEK CNT — antistatic, 260 °C long-term heat resistance

CMP retaining rings with double the service life of PPS or PEI rings

Wafer carriers, photomask pods, wafer clamps and vacuum suction pens

Semiconductor packaging test socket materials

### Question not answered here?

Send us the grade and application, our engineers will advise.

  *Your name***Company Email***Phone / WhatsApp Country Product of interest Quantity Target price Application  Message Send inquiry*
  We only use your details to reply to this inquiry. We never share them.

### Need a quotation or product data?

      Send us your specification and we will come back with a solution within 24 hours.

    [Get a quote](/en/contact)
      [tjh@rjplastics.com](mailto:tjh@rjplastics.com)